Logical-Physical Co-design for Deep Submicron Circuits: Challenges and Solutions (Embedded Tutorial)
نویسنده
چکیده
{ As IC fabrication capabilities extend down to sub-half-micron, the signiicance of interconnect delay and power dissipation can no longer be ignored. Existing enhancements to synthesis and physical design tools have not been able to solve the problem. The only remaining alternative is that tradeoos in logical and physical domains must be addressed in an integrated manner. Vast business opportunities will be lost unless more revolutionary changes to design ow are made. This paper discusses three technologies which are key to performing logic synthesis and physical layout optimization in tandem. They are early oorplanning, layout-driven logic synthesis, and post-layout resynthesis.
منابع مشابه
Logical-Physical Co-design for Deep Submicron Circuits: Challenges and Solutions
As IC fabrication capabilities ex tend down to sub half micron the signi cance of interconnect delay and power dissipation can no longer be ignored Existing enhancements to synthesis and physical design tools have not been able to solve the problem The only re maining alternative is that tradeo s in logical and physical domains must be addressed in an integrated manner Vast business opportuniti...
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